Modular housing structure for modem
US6967846B2 · kind B2 · utility
4Cited by
11References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 7, 2003 |
| Grant date | Nov 22, 2005 |
| Priority date | — |
| Expiry date | Jul 19, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1427
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A modular housing structure having: a top casing; a bottom casing, assembled with the top casing, wherein at least a first circuit board is interposed between the top casing and the bottom casing; and a thickening set interposed between the top casing and the bottom casing and assembled with the top casing and the bottom casing via a plurality of fixing elements so as to accommodate other members such that an electronic device having the housing structure meets at least two specifications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.