System and method for cooling multiple logic modules
US6968709B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2003 |
| Grant date | Nov 29, 2005 |
| Priority date | — |
| Expiry date | Dec 1, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A method and system of cooling hardware, sensing hardware, and supporting code streams that enables a non-redundant liquid cooling system to be used seemlessly in conjunction with an air cooling backup solution. The result offers system speed and reliability benefits of liquid cooling except for the brief occasions when the primary cooling system has failed and air cooling takes over. Until the liquid cooling is repaired, system clocks are automatically slowed to be compatible with the circuit speeds possible at the higher temperatures associated with air cooling. When the liquid cooling is repaired, the system clocks are automatically returned to their normal fast state. Depending on the circuit technology used, a supplied voltage may be varied while being air cooled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.