Patent · US Expired

Method of fabricating sub-micron hemispherical and hemicylidrical structures from non-spherically shaped templates

US6969472B2 · kind B2 · utility

14Cited by
7References
21Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 25, 2001
Grant dateNov 29, 2005
Priority date
Expiry dateDec 4, 2022

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG11B7/00718
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A method for manufacturing hemi-cylindrical and hemi-spherical micro structures is provided. A pattern is formed onto a substrate, and a layer of material is subsequently grown onto the substrate. Due to growth characteristics, the layer will form radially symmetric features when grown to an appropriate thickness.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.