Method for manufacturing micro-structural unit
US6969629B2 · kind B2 · utility
3Cited by
1References
8Claims
0Family size
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Key dates
| Filing date | Mar 4, 2004 |
| Grant date | Nov 29, 2005 |
| Priority date | — |
| Expiry date | Mar 4, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/04
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for manufacturing a micro-structural unit is provided. By the method, micro-machining is performed on a material substrate including first through third conductive layers and two insulating layers, one of which is interposed between the first and the second conductive layers, and the other between the second and the third conductive layers. The method includes several etching steps performed on the layers of the material substrate that are different in thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.