Cooling structure for multichip module
US6969907B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2002 |
| Grant date | Nov 29, 2005 |
| Priority date | — |
| Expiry date | Oct 3, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/93
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A first electronic device, a second electronic device which generates less heat than the first electric device, and an electrode are connected by a heat leveling plate formed of an electrically conductive material having high thermal conductivity. A heat radiation plate is provided below an insulated substrate to which the first and second electronic devices are mounted. The second electronic device is cooled by a heat radiation path which extends through the insulated substrate and the heat radiation plate and a heat radiation path which extends through the second electronic device and the electrode to the heat radiation plate. The first and the second electronic device have substantially the same temperature due to heat radiation through the heat leveling plate. As a result, cooling effect of the electronic devices can be enhanced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.