Heat sink
US6971243B2 · kind B2 · utility
7Cited by
24References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 3, 2004 |
| Grant date | Dec 6, 2005 |
| Priority date | — |
| Expiry date | Aug 3, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink is described for extracting heat from at least one electronic device, such as a microprocessor, either directly or indirectly (i.e. via liquid coolant). The heat sink includes a first thermal plate, a second thermal plate and a plurality of fins integral with and extending between both the first thermal plate and the second thermal plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.