Strippable cable shield compositions
US6972099B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 30, 2003 |
| Grant date | Dec 6, 2005 |
| Priority date | — |
| Expiry date | Aug 20, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B3/447
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A semiconductive resin composition for use as a semiconductive layer in contact with a crosslinked wire and cable insulation layer is disclosed for use where the insulation layer is crosslinked using a peroxide cure system. The resin has a two component base polymer where the first component has a weight average molecular weight of not more than 200,000. The second component is either a polymer having a melting point between 110° C. and 130° C. or a nitrile rubber. The composition also has an adhesion modifying compound different from the base polymer and carbon black. Methods of making the composition and cables using the composition are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.