Method for producing a radiation-emitting semiconductor chip

US6972212B2 · kind B2 · utility

Assignee

• OSRAM GmbH · DE

Inventors

• Dominik Eisert · Regensberg, DE
• Volker Harle · Hemau, DE
• Frank Kuhn · Munich, DE
• Ulrich Zehnder · Regensburg, DE

Key dates

• Filing date: Sep 24, 2004
• Grant date: Dec 6, 2005
• Expiry date: Sep 24, 2024

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/819

Abstract

A semiconductor chip has a substrate that is in the form of a parallelepiped whose side surfaces are shaped as tilted parallelograms. Such a semiconductor chip has a high output efficiency and a homogeneous thermal load due to having at least two side surfaces that are provided with an acute angle and are in the form of parallelograms.