Method for connecting microchips to an antenna arranged on a support strip for producing a transponder
US6972394B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2002 |
| Grant date | Dec 6, 2005 |
| Priority date | — |
| Expiry date | Aug 10, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/0775
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method of connecting micro-chip modules to antennas arranged on a first carrier tape for the manufacture of transponders. The method is characterised in that the micro-chips are packaged in a preceding bonding process to form a chip module with electrical terminals and are applied to a second carrier tape. The two carrier tapes are wound off a reel and brought one above the other, whereby the chip modules are removed from the second carrier tape and placed at a predetermined point on the first carrier tape. This method facilitates a continuous manufacturing process which is particularly economical and particularly fast.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.