Input/output structure and integrated circuit using the same
US6972445B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 11, 2004 |
| Grant date | Dec 6, 2005 |
| Priority date | — |
| Expiry date | Jun 11, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An input/output structure for a die to support an Accelerated Graphic Port (AGP) standard and a Peripheral Component Interconnection Express (PCIE) standard is provided. The I/O structureis suitable for the die pad. It comprises: a PCIE input/output pad for supporting PCIE standard; an AGP input/output pad for supporting AGP standard; a die pad coupled to an external circuit; a first conducting distributed wire coupled to the PCIE input/output pad and the die pad; and a second conducting distributed wire coupled to the AGP input/output pad and the die pad; wherein only one of the PCIE input/output pad and the AGP input/output pad is enabled at the same time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.