Package with stacked substrates
US6972479B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2004 |
| Grant date | Dec 6, 2005 |
| Priority date | — |
| Expiry date | Aug 8, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10924
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package having a plurality of stacked substrates is provided. The package has at least two substrates. One substrate is stacked over the other to construct a three-dimensional circuit structure. Elements are disposed on the respective substrates. At least a conductive column is disposed between the two substrates. A lead-frame is connected to the substrates or the elements. The lead-frame also has a plurality of leads. The two neighboring substrates are electrically connected through the conductive column so that the average signal transmission length is shortened and the signal transmission quality is improved. Furthermore, the conductive column increases the mechanical strength of the package and reduces the degree of warping in the package so that a longer life span can be expected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.