Methods and apparatus for packaging integrated circuit devices

US6972480B2 · kind B2 · utility

Assignee

• SHELL CASE LIMITED · IL

Inventors

• Gil Zilber · Ramat Gan, IL
• Reuven Katraro · Rishon LeZion, IL
• Julia Aksenton · Jerusalem, IL
• Vage Oganesian · Sunnyvale, US

Key dates

• Filing date: Jun 16, 2003
• Grant date: Dec 6, 2005
• Expiry date: Jun 20, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/14
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and an active surface formed on the first generally planar surface, at least one chip scale packaging layer formed over the active surface and at least one electrical contact formed over the at least one chip scale packaging layer, the at least one electrical contact being connected to circuitry on the active surface by at least one pad formed on the first generally planar surface.