Multi chip package structure having a plurality of semiconductor chips mounted in the same package
US6972487B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2002 |
| Grant date | Dec 6, 2005 |
| Priority date | — |
| Expiry date | Jun 10, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a semiconductor device having an MCP (Multi Chip Package) structure in which a plurality of semiconductor chips are mounted in the same package, a manufacturing method therefor and a semiconductor Substrate used therein. Atop a first semiconductor chip that is a memory chip is mounted a second Semiconductor chip that is a logic chip, with a first functional chip and a second functional chip that together form the first semiconductor chip being joined together via an unsliced scribe line. Additionally, a first functional chip and a second functional chip are given the same chip composition (32-bit memory) and respectively rotated 180 degrees relative to each other. These configurations are intended to improve performance, reduce costs and improve yield.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.