Heat dissipating device for electronic components of electronic control devices
US6972959B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2003 |
| Grant date | Dec 6, 2005 |
| Priority date | — |
| Expiry date | Nov 17, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31522
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device is disclosed for dissipating the heat produced by electronic components (16) of an electronic control device. The electronic control device includes a circuit board (14), a resin protective case (10), and a metal actuator block (20). The electronic components are mounted on the circuit board. The protective case confines the circuit board within a thermally restrictive environment. The actuator block is mounted to the outside of the protective case. The heat dissipation device includes a heat conduction path (24, 30) that serves to thermally conduct the heat produced by the electronic components from the interior of the protective case to the actuator block.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.