Method for integrated high Q inductors in FCGBA packages
US6972965B2 · kind B2 · utility
5Cited by
9References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2003 |
| Grant date | Dec 6, 2005 |
| Priority date | — |
| Expiry date | Oct 16, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high quality factor on-package, off-die inductor assembly is disclosed. The assembly includes a flip-chip, ball-grid array package substrate, an on-package, off-die trace line is coupled to one or more bumps attached to an upper surface of the package substrate. The trace line has a self-inductance and a predetermined length. The quality factor associated with the inductor is a ratio of the trace line's inductance to the trace lines resistance. The package substrate is a low loss laminate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.