Wafer and method
US6973833B2 · kind B2 · utility
7Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2002 |
| Grant date | Dec 13, 2005 |
| Priority date | — |
| Expiry date | Mar 12, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/102
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A wafer for placement in a pipe. The wafer includes a housing having an outer surface and an orifice adapted to allow fluid flowing in the pipe to pass through the housing. The housing has at least a first port extending into the housing from the outer surface for holding a first acoustic transducer. The wafer includes means for attaching the housing to the pipe. A method for obtaining information about fluid in a pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.