High-density multi-port-module patch panel system
US6974348B2 · kind B2 · utility
36Cited by
5References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 4, 2004 |
| Grant date | Dec 13, 2005 |
| Priority date | — |
| Expiry date | Mar 4, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04Q1/13
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A high-density multi-port-module patch panel system includes angled multi-port modules. The system accommodates a high density of cable connections, while also providing effective cable management without increasing the maintenance costs or sacrificing the network performance. The angled multi-port modules exert less stress on the connectors and portions of the cabling adjacent to the connectors. Further, the angled arrangement provides a neater arrangement, and better facilitates maintenance and service procedures by providing improved visibility of labeling surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.