IC module, and wireless information-storage medium and wireless information-transmitting/receiving apparatus including the IC module
US6974909B2 · kind B2 · utility
30Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 2003 |
| Grant date | Dec 13, 2005 |
| Priority date | — |
| Expiry date | Aug 21, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An IC module includes a lead frame having terminals that are to be connected to an antenna coil of an IC card, and an IC chip and multilayer chip capacitors for tuning mounted on the lead frame and encapsulated by a resin. The multilayer chip capacitors are mounted in grooves on the lead frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.