Optoelectronic semiconductor component having multiple external connections

US6975011B2 · kind B2 · utility

Assignee

• OSRAM GmbH · DE

Inventors

• Karlheinz Arndt · Regensburg, DE
• Herbert Brunner · Sinzing, DE
• Franz Schellhorn · Regensburg, DE
• Gunter Waitl · Regensburg, DE

Key dates

• Filing date: Apr 6, 2004
• Grant date: Dec 13, 2005
• Expiry date: Apr 6, 2024

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8585

Abstract

A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.