Polygon binning process for tile-based rendering
US6975318B2 · kind B2 · utility
29Cited by
55References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2002 |
| Grant date | Dec 13, 2005 |
| Priority date | — |
| Expiry date | Oct 7, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T11/40
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Binning polygons in a three-dimensional graphics system includes constructing a first bounding box around a first-level polygon, the first bounding box including tiles that contain the first-level polygon, subdividing the first-level polygon into second-level polygons if the first bounding box exceeds a predetermined size, and constructing bounding boxes around each second-level polygon. The second bounding box includes fewer tiles than the first bounding box.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.