In-situ randomization and recording of wafer processing order at process tools
US6975920B2 · kind B2 · utility
5Cited by
11References
5Claims
0Family size
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Key dates
| Filing date | Dec 4, 2003 |
| Grant date | Dec 13, 2005 |
| Priority date | — |
| Expiry date | Dec 4, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/137
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
Wafer order is randomized in-situ by use of a separate wafer staging area and randomly shuffling wafers to and from this staging area to shuffle the processing order of the wafer lot. Positional data is captured for each wafer at both the send and receive ends of the process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.