Pinless solder joint for coupling circuit boards
US6976849B2 · kind B2 · utility
0Cited by
8References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2004 |
| Grant date | Dec 20, 2005 |
| Priority date | — |
| Expiry date | Apr 12, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0415
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A technique for connecting a first circuit board to a second circuit board includes aligning appropriate apertures in the circuit boards and forming a solder joint through the aligned apertures. In one application, the techniques of the present invention are used to connect circuit boards of an implantable medical device, such as a cardiac rhythm management device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.