Method of manufacturing an electronic circuit and manufacturing apparatus of an electronic circuit
US6977130B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2003 |
| Grant date | Dec 20, 2005 |
| Priority date | — |
| Expiry date | Dec 15, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0537
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of manufacturing an electronic circuit satisfying demands for cost reduction, diversified small-quantity production, and a shorter cycle of design, manufacture, evaluation, correction, and so on is provided. The method includes at least forming a first pattern or forming a second pattern. Forming the first pattern comprises: forming a visible image on an electrostatic latent image formed on a photosensitive base, by the adhesion of charged particles essentially made of a resin; transferring the visible image onto the intermediate transfer base by the contact and pressurization of the visible image; heating/softening on the intermediate transfer base; and transferring a heated/softened resin layer onto a base material by the contact and pressurization of the resin layer. In forming the second pattern, using charged particles containing conductive metal particulates, a conductor metal layer is formed by electroless plating after a metal-containing resin pattern is transferred similarly to the first pattern formation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.