Chip package sealing method
US6977187B2 · kind B2 · utility
11Cited by
29References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2003 |
| Grant date | Dec 20, 2005 |
| Priority date | — |
| Expiry date | Sep 11, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a package including manufacturing a substrate to include at least one layer of LCP material, manufacturing a cover made of LCP material to include a lower lip, and sealing the cover to the substrate by heating the interface between the lower lip and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.