Multi-layer PCB and method for coupling block type multichannel optical signals
US6978058B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2003 |
| Grant date | Dec 20, 2005 |
| Priority date | — |
| Expiry date | Mar 17, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/3692
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention discloses a multi-layer Printed Circuit Board (PCB) and method for coupling block type multichannel optical signals, the method including the steps of i) forming one or more first optical via holes to allow one or more first optical signal coupling blocks to be inserted therein, ii) aligning a first optical waveguide and the first optical signal coupling blocks so that the first optical waveguide is interconnected to the first optical signal coupling blocks via an optical signal, iii) attaching a first fixing guide to a base board to fasten the first optical signal coupling blocks, iv) removing the first fixing guide and forming one or more second optical via holes to allow one or more second optical signal coupling blocks to be inserted therein, and v) repeatedly performing steps i) to iv) as many times as a number of layers of the multi-layer PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.