Active heat sink
US6978827B2 · kind B2 · utility
24Cited by
19References
56Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 23, 2003 |
| Grant date | Dec 27, 2005 |
| Priority date | — |
| Expiry date | Jun 24, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling device is provided for dissipating heat from a heat source such as, e.g., an integrated circuit. The cooling device includes a heat sink having a fin structure, a blower assembled with the heat sink for moving air through the fin structure, and a spring attachment mechanism for clamping the heat sink to the heat source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.