PLANAR LIGHT ILLUMINATION AND IMAGING (PLIIM) BASED SYSTEM HAVING A LINEAR IMAGE DETECTION CHIP MOUNTING ASSEMBLY WITH MEANS FOR PREVENTING MISALIGNMENT BETWEEN THE FIELD OF VIEW (FOV) OF SAID LINEAR IMAGE DETECTION CHIP AND THE CO-PLANAR LASER ILLUMINATION BEAM (PLIB) PRODUCED BY SAID PLIIM BASED SYSTEM, IN RESPONSE TO THERMAL EXPANSION AND/OR CONTRACTION WITHIN SAID PLIIM BASED SYSTEM

US6978935B2 · kind B2 · utility

Assignee

• METROLOGIC INSTRUMENTS, INC. · US

Inventors

• Constantine J. Tsikos · Voorhees, US
• C. Harry Knowles · Moorestown, US
• Xiaoxun Zhu · Marlton, US
• Michael Schnee · Chester, US
• Ka Man Au · Philadelphia, US
• Allan Wirth · Bedford, US
• Timothy Good · Blackwood, US
• Andrew Jankevics · Westford, US
• Sankar Ghosh · Philadelphia, US
• Charles A. Naylor · Sewell, US
• Thomas Amundsen · Turnersville, US
• Robert Blake · Woodbury Heights, US
• William Svedas · Deptford, US
• Shawn Defoney · Runnemede, US
• Edward Skypala · Blackwood, US
• Pirooz Vatan · Lexington, US
• Russell Joseph Dobbs · Cherry Hill, US
• George Kolis · Pennsauken, US
• Mark S. Schmidt · San Diego, US
• Jeffery Yorsz · Winchester, US
• Patrick Giordano · Glassboro, US
• Stephen J. Colavito · Westtown, US
• David Wilz · Sewell, US
• Barry E. Schwartz · Haddonfield, US
• Steven Y. Kim · Cambridge, US
• Dale Fisher · Willow View Lane, US
• Jon Van Tassell · Winthrop, US

Key dates

• Filing date: Apr 23, 2002
• Grant date: Dec 27, 2005
• Expiry date: Sep 11, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01S5/02325
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A planar laser illumination and imaging (PLIIM) based system comprising a linear image formation and detection module having (i) an image sensing chip having a plurality of conductive pins establishing electrical interconnections with conductive elements within a chip mounting socket mounted on an electronic camera board, and (ii) image forming optics with a field of view. The system also includes a heat-exchanging structure, rigidly connected to the image formation optics, and having (i) a body portion provided with heat exchanging elements, (ii) a plurality of apertures through which the plurality of conductive pins on the image sensing chip pass to establish electrical interconnections with the conductive elements within the chip mounting socket, and (III) a plurality of mechanical elements for releasably engaging the package of the image sensing chip so as to rigidly maintain the image sensing chip in alignment with the image forming optics.