Patent · US Expired

Pressure piece for use in a power semiconductor module

US6979204B2 · kind B2 · utility

12Cited by

4References

7Claims

0Family size

Assignee

SEMIKRON ELEKTRONIK GMBH & CO. KG · DE

Inventors

Christian Göbl · Koblenzer Straße, DE
Rainer Popp · Petersaurach, DE
Marco Lederer · Hirschaid, DE

Key dates

Filing date	Feb 18, 2004
Grant date	Dec 27, 2005
Priority date	—
Expiry date	Feb 18, 2024

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19043
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A pressure piece for a compact power semiconductor module for direct mounting on a heat sink. The power semiconductor module has resilient connection leads for electrical connection to a printed circuit board disposed outside the housing. The pressure piece is dimensionally stable and effects pressure-contact between the printed circuit board and the connection leads. On its primary face facing the printed circuit board, the pressure piece has a plurality of pressure elements that space the primary face from the printed circuit board. In a preferred embodiment at least one rib includes a notch. Preferably, the pressure piece has at least one opening connecting its two primary faces permitting fluid flow between the edge of the pressure element and the notch.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.