Structures and fabrication techniques for solid state electrochemical devices
US6979511B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2002 |
| Grant date | Dec 27, 2005 |
| Priority date | — |
| Expiry date | Aug 22, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49115
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Provided are low-cost, mechanically strong, highly electronically conductive porous substrates and associated structures for solid-state electrochemical devices, techniques for forming these structures, and devices incorporating the structures. The invention provides solid state electrochemical device substrates of novel composition and techniques for forming thin electrode/membrane/electrolyte coatings on the novel or more conventional substrates. In particular, in one embodiment the invention provides techniques for co-firing of device substrate (often an electrode) with an electrolyte or membrane layer to form densified electrolyte/membrane films 5 to 20 microns thick. In another embodiment, densified electrolyte/membrane films 5 to 20 microns thick may be formed on a pre-sintered substrate by a constrained sintering process. In some cases, the substrate may be a porous metal, alloy, or non-nickel cermet incorporating one or more of the transition metals Cr, Fe, Cu and Ag, or alloys thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.