Micro-electromechanical system
US6979585B2 · kind B2 · utility
2Cited by
4References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2003 |
| Grant date | Dec 27, 2005 |
| Priority date | — |
| Expiry date | Jan 8, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/019
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A microelectromechanical system (MEMS) device is created by forming mechanical structures supported by a substrate having a bond ring area laterally spaced from the mechanical structures and having a sacrificial layer surrounding the mechanical structures. A bond ring material is formed on top of the sacrificial layer and the bond ring area. Some of the bond ring material is then removed to create a bond ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.