Interlayer connections for layered electronic devices

US6979643B2 · kind B2 · utility

Assignee

• Thin Film Electronics ASA · NO

Inventors

• Goran Gustafsson · Säter, SE
• Peter Dyreklev · Linköping, SE
• Johan Carlsson · Cologne, DE

Key dates

• Filing date: Nov 25, 2003
• Grant date: Dec 27, 2005
• Expiry date: Nov 25, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/76816
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

In a method for forming interlayer connections, metal conducting paths in an overlaying layer and vias forming the deposit in one and the same operation. In an interlayer connection formed in this manner the vias are provided integral with connecting conducting paths in the overlaying layer.