Integrated heat dissipating enclosure for electronic product
US6979772B2 · kind B2 · utility
16Cited by
9References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 2003 |
| Grant date | Dec 27, 2005 |
| Priority date | — |
| Expiry date | Feb 24, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20418
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An integrated heat dissipating enclosure to provide heat dissipation for computer, power supply or other electronic products such as an integrated circuit on a motherboard, a central processing unit, or a chip on a video adapter. The enclosure has a frame and a cooling cover. The frame is used to carry various internal components or peripherals of a computer. The cooling cover has a plurality of fins spaced from each other by a space. The fins are connected together by a thermal conductive pipe to form an integrated heat dissipating enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.