Laser system and method for material processing with ultra fast lasers
US6979798B2 · kind B2 · utility
29Cited by
19References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2004 |
| Grant date | Dec 27, 2005 |
| Priority date | — |
| Expiry date | Apr 30, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Laser system and method for material processing with ultra fast lasers are provided. One aspect of the invention features the method which removes at least a portion of a target structure such as a memory link while avoiding undesirable damage to adjacent non-target structures. The method includes applying a single ultra short laser pulse to the target structure to remove the target structure with the single pulse.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.