Patent · US Expired

Method and apparatus for a formatter following electron beam substrate processing system

US6979831B2 · kind B2 · utility

4Cited by
8References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 19, 2004
Grant dateDec 27, 2005
Priority date
Expiry dateMay 28, 2024

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J37/3053
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

Embodiments of the invention generally provide an electron beam substrate processing system. In one embodiment, the present invention provides an electron beam substrate processing system where a spindle shaft used to rotate substrates during processing includes at least one optical encoder wheel assembly. The optical encoder wheel assembly is configured to provide rotational speed data signal to a rotational speed control system and a pattern generation clock circuit configured to a provide a corrected pattern generator clock signal to a pattern generator circuit. The pattern generation circuit is used to control modulation of an electron beam used for substrate processing. In one aspect of the present invention, repeatable deviations of the rotational speed are measured and processed during substrate processing to correct for such repeatable deviations to increase substrate pattern writing accuracy.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.