Integrated circuit packaging architecture
US6979891B2 · kind B2 · utility
7Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2003 |
| Grant date | Dec 27, 2005 |
| Priority date | — |
| Expiry date | Apr 1, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0263
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system may include an integrated circuit package having a package power contact and a package ground contact, and an interposer to physically receive a portion of the package and including a lip. A system may also include a first card having a card power contact to interface with the package power contact and a card ground contact to interface with the package ground contact, where the first card defines an opening to receive a portion of the interposer, and the lip is to support a portion of the first card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.