Method and apparatus for controlling the temperature of electronic device enclosures
US6980418B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2004 |
| Grant date | Dec 27, 2005 |
| Priority date | — |
| Expiry date | Jul 26, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S493/903
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electronic device housing comprising a device enclosure with electronic components mounted inside the enclosure is disclosed. Mounted between the electronic device housing and the device enclosure is a thermally reflective electrical insulator configured to reduce external heating of the enclosure by the electronic components contained therein. Such an arrangement reflects heat generated by internal electronic components back inside the device enclosure, thereby reducing the external temperature of the electronic device housing. The electronic device housing, for example, pertains to a portable computer. Additionally, a method for reducing the external temperature of a computer housing for a portable computer is disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.