Laser cutting method and system
US6980571B1 · kind B1 · utility
7Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 17, 2002 |
| Grant date | Dec 27, 2005 |
| Priority date | — |
| Expiry date | Mar 13, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/1643
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Material is laser milled by generating a series of laser pulses, each pulse possessing a main portion and a tail, and preventing the energy in one or more portions of the pulse, from striking the material being processed. In one embodiment this is done by terminating the pulse before a portion of the tail is generated, thereby to reduce thermal stress and leave smooth edges on the laser-milled material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.