Process for efficient light extraction from light emitting chips
US6980710B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2003 |
| Grant date | Dec 27, 2005 |
| Priority date | — |
| Expiry date | Jan 7, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/43
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention claims a unique way to pattern an optical microstructure immediately on top of a mass produced light-emitting device, such as a light emitting diode (LED), a vertical cavity surface emitting laser (VCSEL) or a photo detector, for the purpose of efficient coupling of light to or from the active region of the light-emitting device. The invention addresses the need to effectively and efficiently extract light from the light-emitting optoelectronic device. Finally, the invention allows for the optical microstructure to be deposited and patterned directly over the light-emitting device contained on a suitable substrate, such as a wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.