Multiple use of microcontroller pad
US6981090B1 · kind B1 · utility
110Cited by
33References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2001 |
| Grant date | Dec 27, 2005 |
| Priority date | — |
| Expiry date | Aug 24, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F13/4022
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A circuit arrangement permits a microcontroller wirebond pad to be configured to be an analog or digital input or output. The circuit arrangement uses any of a plurality of switching configurations to selectively determine the use of the wirebond pad under control of the microcontroller's processor. The microcontroller can be configured using configurable analog and configurable digital blocks to perform any of a plurality of functions with certain of the pinouts determined under program control.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.