Method of forming a lead
US6981314B2 · kind B2 · utility
84Cited by
46References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2002 |
| Grant date | Jan 3, 2006 |
| Priority date | — |
| Expiry date | Jun 19, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4922
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An implantable, substantially isodiametric, low resistance implantable lead having at least one electrode positioned in a stimulation/sensing portion of the lead as well as a method of manufacturing the same. At least the stimulation/sensing portion is unitized through partially surrounding and supporting insulation and conductive element(s) of the stimulation/sensing portion with a fused matrix of material having mechanical properties consistent with a body of the lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.