Wire sawing process and device
US6981495B2 · kind B2 · utility
3Cited by
8References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2004 |
| Grant date | Jan 3, 2006 |
| Priority date | — |
| Expiry date | Mar 7, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23D57/0046
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In the sawing process and device according to the invention, the pieces to be sawed are mounted on at least one support table and caused to bear against a layer of wires. Inclination structure in the form of wedges or pieces for angular adjustment by pivoting and blocking, are provided to mount the pieces obliquely with angles of inclination between one of their prismatic surfaces and a horizontal working plane. There is thus obtained a precise beginning of sawing with sawed slices of equal thickness and a careful end of cutting without chipping.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.