Patent · US Expired

Semiconductor device and method for manufacturing the same

US6982194B2 · kind B2 · utility

23Cited by
48References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 19, 2002
Grant dateJan 3, 2006
Priority date
Expiry dateApr 26, 2022

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D86/0231

Abstract

A semiconductor device, comprises a first electrode, a semiconductor film, a first insulating film and a second insulating film formed between the semiconductor film and the first electrode, a second electrode, and a third insulating film formed between the semiconductor film and the second electrode. The semiconductor film is formed on a flat surface of the second insulating film. A cross portion where the first electrode and the second electrode cross the semiconductor film at the same position is formed. The first electrode and the second electrode are connected to each other through an opening made in the first insulating film and the second insulating film outside the cross portion.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.