Patent · US Expired

Encapsulated component which is small in terms of height and method for producing the same

US6982380B2 · kind B2 · utility

25Cited by

5References

29Claims

0Family size

Assignee

EPCOS AG · DE

Inventors

Christian Hoffmann · Leonberg, DE
Jürgen Portmann · Munich, DE
Hans Krueger · Munich, DE

Key dates

Filing date	Dec 11, 2002
Grant date	Jan 3, 2006
Priority date	—
Expiry date	Jan 6, 2023

Classification

Technology area (CPC H)Electricity
CPC primaryH10D62/117
WIPO fieldBasic communication processes
WIPO sectorElectrical engineering

Abstract

For simpler and safer encapsulation of components, it is proposed to generate the connection between a chip and a carrier substrate by means of bump connections that are sunk into recesses on the carrier substrate. The component thereby lies directly on the carrier substrate, in particular on a frame circumscribing the component structures on the chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.