Semiconductor package with leadframe inductors
US6982479B2 · kind B2 · utility
6Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2003 |
| Grant date | Jan 3, 2006 |
| Priority date | — |
| Expiry date | Sep 24, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device in which an inductance element formed in a resin package has stable characteristics, impedance matching is achieved easily, and the stability of high-frequency characteristics is improved, more particularly a semiconductor chip sealed within mold resin having a conductor lead extending from an inside of the mold resin to an outside. A portion of the conductor lead inside the mold resin forms an inductance element, at least a part of which is narrower than the external portion of the conductor outside the mold resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.