Semiconductor joining substrate utilizing a tape with adhesive and copper-clad laminate sheet
US6982484B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2001 |
| Grant date | Jan 3, 2006 |
| Priority date | — |
| Expiry date | Aug 22, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/287
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to an adhesive-backed tape for semiconductors which is characterized in that it is composed of a laminate of an insulating film layer having the following characteristics (1) and (2) and at least one adhesive agent layer in the semi-cured state. By means of this construction the present invention can provide, on an industrial basis, an adhesive-backed tape suitable for producing semiconductor devices, together with copper-clad laminates, semiconductor connecting substrates and semiconductor devices employing said tape, and it enables, the reliability of semiconductor devices for high density mounting to be enhanced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.