Thermal solution for electronic devices
US6982874B2 · kind B2 · utility
56Cited by
17References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2003 |
| Grant date | Jan 3, 2006 |
| Priority date | — |
| Expiry date | Dec 18, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A thermal solution for an electronic device, which is positioned between a heat source and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the external surface and/or second component from the heat generated by the heat source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.