Printed circuit board assembly
US6982876B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 13, 2000 |
| Grant date | Jan 3, 2006 |
| Priority date | — |
| Expiry date | Jul 10, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A PCB assembly (1) in this case a DC-DC converter comprising a single layer board (2), mounts power semi-conductor devices forming high heat generating components (3) and various cores of magnetic material forming heat dissipating components (4). Tracks of heat conductive coupling material (6) lie above or below each heat generating component (3) and project into one of the heat dissipating components (4) and beside the others. In one embodiment, the heat generating components (3) are housed within a heat dissipating component (3). In another PCB assembly, there is an additional plug-in PCB which may itself carry heat generating components (3) or only heat dissipating components (4). In the latter case, the heat generating components (3) are mounted on the PCB assembly below the additional plug-in PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.