Method of mounting component on a circuit board
US6983538B2 · kind B2 · utility
6Cited by
13References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2003 |
| Grant date | Jan 10, 2006 |
| Priority date | — |
| Expiry date | Jun 23, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of mounting a component on an electrode on a board. Mounting coordinates for mounting the component are calculated. A determination is made of printing positions where solder for the component is situation on the electrode. The printing positions of the solder are stored. Mounting position data for where the component is to be mounted on the solder is prepared based on the previous steps. The component is mounted using the information gathered in the previous steps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.