System and method for providing cooling systems with heat exchangers
US6983789B2 · kind B2 · utility
10Cited by
13References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2005 |
| Grant date | Jan 10, 2006 |
| Priority date | — |
| Expiry date | Apr 22, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/905
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A cooling system is provided with a heat exchanger that has a thermally conductive tube over-molded with a plurality of thermally conductive fins. To form the heat exchanger, a thermally conductive tube is provided. Insert molding, over molding or injection molding is utilized to incorporate thermally conductive fins with the thermally conductive tubes. The molding process may also simultaneously create any required features, such as mounting features and fittings for tubing to be connected to the heat exchanger.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.