Compact package design for vertical cavity surface emitting laser array to optical fiber cable connection
US6984076B2 · kind B2 · utility
4Cited by
9References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2003 |
| Grant date | Jan 10, 2006 |
| Priority date | — |
| Expiry date | Dec 15, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/423
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A housing for opto-electronic array devices. The housing includes a base and walls that form a region that receives an opto-electronic semiconductor array. Conductive traces are disposed on a wall such that a front part of the traces are exposed for external electrical connections, while the back part is exposed for internal electrical connections. A transparent substrate having a plurality of micro-lenses cover the base, walls and opto-electronic semiconductor array device. Each micro lens is beneficially made from optical epoxy that is deposited by an ink-jet nozzle. The base and walls are beneficially comprised of a ceramic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.